European Tender Dry Etcher
Universiteit Twente has issued a closed public tender (No. 337390) for a new Dry Etcher. The project focuses on an advanced chip-etch system with precise, uniform processes for silicon on 100–150 mm wafers. The deadline is 15 July 2024 and the tender value is not precisely estimated. The CPV code is unknown, it is a European digital procedure and there is no linked reference. **Key points** - **Objective**: New Dry Etcher for nano-/micro-scale structures with 2 nm precision. - **Specifications**: * Etch rates 1 nm/min – 15 µm/min. * Uniform plasma, three-source ICP/CCP design. * OES, laser interferometry, chiller (-20 °C → 20 °C). * Chemical gases: Ar, O2, N2, SF6, C4F8. - **Value**: Unknown. - **Location**: Netherlands. - **Procedure**: Public, supplies, digital. - **Deadline**: 15 July 2024 12:00 UTC.