Universiteit Twente has issued a closed public tender (No. 337390) for a new Dry Etcher. The project focuses on an advanced chip-etch system with precise, uniform processes for silicon on 100–150 mm wafers. The deadline is 15 July 2024 and the tender value is not precisely estimated. The CPV code is unknown, it is a European digital procedure and there is no linked reference. **Key points** - **Objective**: New Dry Etcher for nano-/micro-scale structures with 2 nm precision. - **Specifications**: * Etch rates 1 nm/min – 15 µm/min. * Uniform plasma, three-source ICP/CCP design. * OES, laser interferometry, chiller (-20 °C → 20 °C). * Chemical gases: Ar, O2, N2, SF6, C4F8. - **Value**: Unknown. - **Location**: Netherlands. - **Procedure**: Public, supplies, digital. - **Deadline**: 15 July 2024 12:00 UTC.
Supplies · Open · European procedure
01What is being requested
Universiteit Twente has issued a closed public tender (No. 337390) for a new Dry Etcher. The project focuses on an advanced chip-etch system with precise, uniform processes for silicon on 100–150 mm wafers. The deadline is 15 July 2024 and the tender value is not precisely estimated. The CPV code is unknown, it is a European digital procedure and there is no linked reference. **Key points** - **Objective**: New Dry Etcher for nano-/micro-scale structures with 2 nm precision. - **Specifications**: * Etch rates 1 nm/min – 15 µm/min. * Uniform plasma, three-source ICP/CCP design. * OES, laser interferometry, chiller (-20 °C → 20 °C). * Chemical gases: Ar, O2, N2, SF6, C4F8. - **Value**: Unknown. - **Location**: Netherlands. - **Procedure**: Public, supplies, digital. - **Deadline**: 15 July 2024 12:00 UTC.
The MESA+ Institute will invest in a new Dry Etch tool system to reinforce their state-of-the-art etch capabilities and etch capacity. Applications: The tool must be capable of etching silicon and/or silicon-based materials for a variety of nano- and/or microscale structures with nanometre precision and high wafer-scale uniformity. The tool must be suitable for the etching of silicon-based materials with etch rates of 1 nm/min up to 15 µm/min. The tool must be equipped with reliable end-pointing, also for loadings of < 5% open area (based on 100 mm wafer), using OES or laser interferometry.
02Exclusion grounds
- No specific exclusion grounds were extracted. In a European tender, the mandatory and discretionary grounds of art. 2.86/2.87 of the Dutch Procurement Act almost always apply — check the European Single Procurement Document (ESPD).
03Value in context
04Bidders in this segment
05Legal themes that may be relevant here
06Frequently asked questions
What are the technical requirements for the etch rate and precision of the Dry Etcher?
What specifications must the plasma design of the tool meet?
Which gases and peripheral equipment are required for the operation of the Dry Etcher?
For which wafer sizes is the uniformity of the tool guaranteed?
Automatically compiled from the official tender data and documents.
07Estimated value versus the market
€ 300K
€ 515K
€ 1,7 mln
Gegunde waarden in CPV 38 · leveringen n=331